Home » Posts tagged 'CFP'

Tag Archives: CFP

[CFP]: The 7th International Conference on Integrated Circuits, Design, and Verification (ICDV 2017)

The 7th International Conference on Integrated Circuits, Design, and Verification (ICDV 2017)

October 5-6, 2017 – Hanoi, Vietnam

http://www.icdv.uet.vnu.edu.vn/

Hosted by

VNU University of Engineering and Technology
Sponsored by

IEEE SSCS Vietnam Chapter and IEICE Vietnam Section
Participating-Sponsored by

IEEE SSCS Japan Chapter, IEEE SSCS Kansai Chapter, and the Radio-Electronics Association of Vietnam

Accepted and presented papers will be included in the conference proceedings with ISBN and will be submitted to the IEEE.

The International Conference on Integrated Circuits, Design, and Verification (ICDV) provides an annual forum for exchanging ideas, discussing research results, and presenting chips, circuit designs and applications in solid-state and semiconductor fields. Continuous scaling of the CMOS devices increases the number of transistors on a VLSI chip. It will soon reach the level of 10 giga transistors on a single chip, which is equivalent to the total neuron numbers in the human brain. This would certainly provide us a great opportunity for new applications and information processing. On the other hands, the small feature size causes new problems such as leakage current and process variation. To discuss utilizing the scaling advantages and coping with the new problems, we call for contributions about new proposal of application systems, VLSI architectures, and design methodologies as well as the technologies in the integrated circuits and devices field. We expect to this conference explores and stimulates the contributed researches to those subjects. The papers are solicited from prospective authors interested in the related fields.

The ICDV 2017 conference is sponsored by the IEEE SSCS Vietnam and the IEICE Vietnam Section, hosted by VNU University of Engineering and Technology (VNU-UET), and will be held in Hanoi, Vietnam. Further details on the conference, paper submission guidelines, and templates will be updated on the website.
************************************************************
***Important Dates*

Title & abstract submission: July 1, 2017
Full manuscript submission: July 10, 2017
Notification of acceptance: August 30, 2017
Camera-ready submission: September 15, 2017

*** Paper Submission ***

Submission link: https://easychair.org/conferences/?conf=icdv2017

http://www.ieee.org/conferences_events/conferences/publishing/templates.html

Prospective authors are invited to submit full-length, maximum six-page manuscripts, including figures, tables and references, to
the official ICDV 2017 website. All papers will be handled electronically. Accepted and presented papers will be included in the conference proceedings with ISBN and will be submitted to the IEEE (the copyright shall be assigned to the IEEE) and will be invited to re-submit an extension to REV Journal on Electronics and Communications (JEC) and VNU Journal of Computer Science and Communication Engineering (JCSCE). Papers are solicited in the following categories, but are not limited to:
1. Digital integrated circuits and signal processing
2. Processors/ multiprocessors
3. Memory design
4. Analog and mixed-signal circuits
5. RF integrated circuits and microwave engineering
6. Circuit technologies
7. Design experience with advanced design technologies
8. Circuits/devices modeling, verification and testing
9. Reconfigurable architectures & FPGA-based designs
10. Embedded systems design
11. IoT related circuits, devices and applications
12. Rebooting computing

***Committees***

General Co-chairs
Xuan-Tu Tran, VNU-UET
Kunio Uchiyama, Hitachi
Ngoc-Binh Nguyen, REV
Ngoc-Nam Pham, HUST

Technical program co-Chairs
Toshimasa Matsuoka, Osaka Uni.
Cong-Kha Pham, Elec.-Comm. Uni.
Van-Phuc Hoang, LQD TU
Loan Pham, HUST

Local Arrangement Chair
Tran Duc Tan, VNU-UET
Kiem-Hung Nguyen, VNU-UET
Secretary
Duy-Hieu Bui, VNU-UET

[EDAS-CFP] SigTelCom 2018 – Special issue on IET Communications “Recent Advances on 5G”

Call for Papers 

The International Conference on Recent Advances on Signal Processing, Telecommunications & Computing (SigTelCom 2018)

January 29-31st, 2018

Post & Telecommunications Institute of Technology, Ho Chi Minh City, Vietnam

http://www.sigtelcom.net/2018/

SigTelCom 2017 is technically co-sponsored by IEEE and IEEE Vietnam Section.

Accepted and presented papers will be published in the conference proceedings and IEEE Xplore® (IEEE Digital Library).

High quality papers will be invited to be submitted to Special Issues “Recent Advances on 5G” of IET Communications (SCI journal and Q2 SCImago)

=================================================================

**Important Dates**

Submission of full papers: June 30th, 2017 

Notification of acceptance:  September 30th, 2017

Camera ready papers and registration: November 1st, 2017

Main Conference: January 29-31st, 2018

=================================================================

**Topics of Interest**

The SigTelCom 2018 seeks original contributions in, but not limited to, the following tracks topical areas:

* Signal Processing

– Decoding and encoding techniques

– Modulation, coding, and diversity techniques

– Signal detection and parameter estimation

– Signal, image and video processing

– Image Processing and Visualization

– Audio, acoustic signal, speech and language processing

– Sensor array, multichannel and communications signal processing

– Radar and sonar array signal processing

– Estimation theory and applications

– Signal processing for education

– Bio-inspired modelling and signal processing

– Signal processing applications

* Telecommunications Systems and Networks

– Cooperative communications

– Cognitive radio and dynamic spectrum access

– Multi-carrier systems, including OFDM

– Multiple-input multiple-output techniques

– Ultra-wideband and spread spectrum communications

– Cellular systems, 2G/2.5G/3G/4G and beyond

– WiMAX, LTE, WMAN, and other emerging broadband wireless networks

– Wireless networks for underwater and UAVs communications

– Delay tolerant wireless networks

– Routing and multicasting protocols

– Wireless ad hoc, mesh networks

– Sensor networks and mobile sensing

– Peer-to-peer wireless networks

– Wireless multimedia networks

– Optical Networks

– Software defined networks

– Software defined datacenters

– Wireless body area network and wireless health

– Overlay and programmable networks

– Internet of Things and smart cities

– Services and support for smart cities

– Software defined smart objects

– Connected vehicles

– Green communications and energy efficiency

– Next generation networks infrastructures and management

– Distributed systems architecture and Management

– Network reliability, quality of service and quality of experience

– Standardization activities of emerging technologies

– Medium access techniques and protocols for telecommunication networks

– Security, cryptography and privacy

– Network design, optimisation and management

– Network planning, capacity analysis, and topology control

– Network measurement, validation and verification schemes

– Testbeds and deployment

* Computing Technologies

– Parallel and distributing computing

– High-performance computing

– Grid computing

– Cloud computing

– Green computing

– Ubiquitous computing

– Peer-to-peer and cluster computing

– Software engineering artificial intelligent systems applications

– Human language technologies

– Knowledge discovery and data mining

– Mobile learning applications

– Mobile development applications

– Pervasive and wearable computing

– Web-based computing and services

– Wireless and mobile computing

– Multimedia computing applications and architectures

– Security and trust computing

– Computing operating systems

– Social networks, crowd sourcing, and crowd sensing

* Electronics and Control Systems

– Devices, circuits and systems

– Power electronics and systems

– Energy systems

– Air and water pollution management and control

– Embedded systems

– Emerging IC technologies

– Monitoring and control of structures

– Consumer and automotive electronics

– Networked control systems

– Automation, robotics and control

– Dynamics, vibration and control

– Intelligent transportation systems

=================================================================

**Submission Guidelines**

Submitted papers must represent original material that is not currently under review in any other conference or journal, and has not been previously published. Authors must submit their work electronically through EDAS system at : https://edas.info/newPaper.php?c=23542

The paper should have a maximum of 6 pages in the IEEE format (available at http://www.sigtelcom.net/2018/). Papers must be submitted in PDF format only.

Accepted and presented papers will be published in the conference proceedings and IEEE Xplore® (IEEE Digital Library).

=================================================================

**Orgnization Committee**

General Chairs:

– Trung Q. Duong, Queen’s University Belfast, UK Le Cong Co, Duy Tan University, Vietnam

 Technical Program Chairs:

– Vo Nguyen Quoc Bao, PTIT, Vietnam

– Hien Q. Ngo, Linköping University, Sweden

Publication Chair:

– Nguyen-Son Vo, Duy Tan University, Vietnam

Tin mới

Thống kê (từ 11/07/2017)

  • 0
  • 15
  • 16,799
  • 264,135
  • 0
  • 420
  • 35
  • 0
November 2017
M T W T F S S
« Oct    
 12345
6789101112
13141516171819
20212223242526
27282930