SoICT 2018: The Ninth International Symposium on Information and Communication Technology

The Ninth International Symposium on Information and Communication Technology (SoICT 2018)

Danang, Vietnam, 6, 7 December 2018.

SoICT 2018 is an international symposium that covers four major areas of research that includes AI and Big Data Analytics, Network Communication and Security, Machine Perception and Interaction, Software Engineering and Information Systems. Following the past successful symposium SoICT 2017, which received submissions from 22 countries, the 9th International Symposium on Information and Communication Technology (SoICT 2018) will be held in Danang, Vietnam. The symposium aims at providing an academic forum for researchers and graduate students to share their latest research findings and to identify future challenges in computer science. The symposium will include tutorials and keynotes given by world-class speakers.

SoICT 2018 proceedings will be published in the International Conference Proceedings Series by ACM as a volume in ACM ICPS (ISBN: 978-1-4503-6539-0), which will be archived in the ACM Digital Library, and indexed by DBLP, Ei Compendex, Scopus and submitted to be reviewed by Thomson Reuters Conference Proceedings Citation Index (ISI Web of Science).

Important Dates



– AUTHOR NOTIFICATION: 13 October 2018


– CONFERENCE DATES: 6, 7 December 2018

General Chairs


Yasushi Yagi, Osaka University, Japan

Marc Bui, EPHE, France

Huynh Quyet Thang, HUST, Vietnam

Steering Committee


Yew-Soon Ong, NTU, Singapore

Ismal Khalil, Austria

Eui-nam Huh, Kyunghee, Korea

Zhenjiang Hu, NII, Japan

Program Chairs


Ichiro IDE, Nagoya, Japan

Michel Toulouse, VGU, Vietnam

Biplab Sikdar, NUS, Singapore

Huynh Thi Thanh Binh, HUST, Vietnam

Contact Us


If you have any further questions on SoICT 2018, please feel free to contact us.


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JULY 18th – 20th, 2018, HUE CITY, VIETNAM


The International Conference on Communications and Electronics (ICCE) is becoming a reputable bi-annual international conference series in the scientific community on the areas of Electronics and Communications recently. Following the past successful IEEE ICCE 2016, which received over 250 submissions from 30 countries with the acceptance rate of 32%, the seventh ICCE (IEEE ICCE 2018) looks for significant contributions to various topics in communications engineering, networking, microwave engineering, signal processing, and electronic engineering. The conference will also include tutorials, workshops, and technology panels given by world-class speakers.


– Technically co-sponsored by: IEEE, IEEE ComSoc, IEEE AP-S and IEEE Photonics
– Publication: All accepted papers will be published in the IEEE ICCE 2018 Conference Proceedings, while papers accepted for oral presentation will be submitted for inclusion in IEEEXplore.
– Location: HUE CITY, Vietnam
– Website:
– Keynote speakers: Yasuhiko Arakawa (University of Tokyo, Japan), Moshe Zukerman (City University of Hong Kong, Hong Kong), Randy Giles (Center for Advancement of Science in Space -NASA, USA), Jan Van der Spiegel (University of Pennsylvania, USA)


FIRM EXTENDED submission deadline: March 16th, 2018
Acceptance notification: May 04th, 2018
Registration & Camera-ready: May 22nd, 2018
Conference date: July 18th – 20th, 2018


All authors should prepare full version of papers with maximum length of 6 pages and submit via EDAS at
All accepted papers will be published in IEEE ICCE 2018 Conference Proceedings, while fully accepted papers with oral presentation will be published in the IEEE ICCE 2018 Conference Proceedings and submitted for inclusion in IEEEXplore.
Contributed papers are solicited describing original works in electronics, communication engineering and related technologies. Topics and technical areas of interest include but are not limited to the following:


– Networking: Future Internet/Future Networks, SDN/NFV, Crowdsourcing, QoS/QoE and Resource Management, Green Networking, Optical Networks; Wireless, Mobile, Ad-hoc and Sensor Networks, Ubiquitous Networks and Internet of Things; Network Security; Cognitive Networks

– Communication Systems: Coding and Information Theory; UWB; Ultrasonic, Under-Water Communications, Satellite Communications/GNSS; Radio-over-Fiber, Free Space and Fiber-Optic Communications; Software Defined Radio, Cognitive Radio; Cooperative Communications, Secured Communication Systems, Multi-Antenna Communication Systems; 5G Systems, Energy-Harvesting, Millimeter-Wave Communications, Device-to-Device Communications,  Green Communications.


– Image and video: Image, Video Processing, Analysis and Applications; 3D Image Processing and Scene Analysis, Multiview Data Integration, 3D Computer Vision Systems and Applications; Image Based Human-Computer Interaction; PACS and Imaging Informatics

– Signals and Systems: Biomedical Signal Processing and Analysis; Computer-Aided Diagnosis; Biomedical Applications in Molecular; Structural, Signal Filtering, Detection and Estimation; Nonlinear and Statistical Signal Processing; Modeling and Reconstruction; Statistical Signal Processing and Modeling; Soft Computing; Signal Processing in Communications

– Applications: PACS and Imaging Informatics; Ambient Intelligence; Image Based Human-Computer Interaction; Virtual Reality.


– Microwave, Millimeter-Wave Devices/ Components Design and Techniques: Passive, Active Devices/Components, MEMS, Integration Techniques, Nano-Scale Devices, Millimeter-Wave and THz Components
– Antenna and Propagation: Wideband, Multiband Antennas, Smart Antennas, Digital Beam Forming, MIMO, Massive MIMO, Antenna Modeling and Measurements,   Phased Arrays, Channel Modeling and Propagation
– EM Field Theory and Simulation Techniques:  EM Field Theory, Numerical Techniques, Metamaterials, FSSs, Electromagnetic Bandgap Structures
– RF, Microwave and Millimeterwave Systems and Applications: Radar, Remote sensing, Sensors and sensor system, Wireless power transmission
– Other related technologies and applications: Nanoscale Integration of Planar, Free-Space, and Mixed Subsystems, 3D Printed RF, RFID

– Electronic Circuits: Analog, Digital, Mixed Signal
– EDA: System Design, Synthesis and Optimization; Formal Methods and Verification
– Architectures and Systems: NoC, Multi-Core, Video and Multimedia, Embedded Systems, Reconfigurable Computing, System-Level Power Management, IoT Devices, Hardware Security, High Performance/Parallel Computing Platforms for Big Data
– Application Systems: Communication, Consumer and Multimedia; Medical and Healthcare; Spacecraft Avionics
Please visit
Please visit

SPECIAL SESSIONS: IEEE ICCE 2018 offers special sessions, which provide an overview of the state-of-the-art and current research directions on communications and electronics. Please visit for more details. PLEASE CONTACT US IF YOU ARE INTERESTED IN OPENING A SPECIAL SESSION.


School of Electronics and Telecommunications
Hanoi University of Science and Technology
C9-405, 1 Dai Co Viet Road, Hanoi, Vietnam
Tel: +84-(0)24-8692242
Fax: +84-(0)24-8692241


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[CFP] 2018 International Conference on Advanced Technologies for Communication (ATC)

2018 International Conference on Advanced Technologies for Communication (ATC)
October 18-20, 2018, Ho Chi Minh City, Vietnam
Hosted by Posts and Telecommunications Institute of Technology (PTIT)


The International Conference on Advanced Technologies for Communications is an annual conference series, since 2008, co-organized by the Radio & Electronics Association of Vietnam (REV) and the IEEE Communications Society (IEEE ComSoc). The goal of the series is twofold: to foster an international forum for scientific and technological exchange among Vietnamese and worldwide scientists and engineers in the fields of electronics, communications and related areas, and to gather their high-quality research contributions.

In 2018, the ATC conference will be held in Ho Chi Minh city, Vietnam during October 18-20, 2018 and hosted by Posts and Telecommunications Institute of Technology. The conference will feature prominent invited speakers as well as papers by top researchers from all over the world.

***Important Dates***
– Manuscript submission: April 30, 2018
– Notification of acceptance: July 15, 2018
– Camera-ready submission: August 15, 2018
– Special Sessions: April 15, 2018

The conference program will run for three days with the regular tracks, special sessions, and workshops. In addition, a number of tutorial sessions will be scheduled for one day before the conference starts. For the tracks and special sessions, we invite you to contribute your original work on topics in the following, but not limited to, areas:

Communications track

• Communication Theory
• Information & Coding Theory
• Communication Quality, Reliability & Modeling
• Wireless Communications

Signal Processing track

• Signal, Image and Video Processing
• Signal Processing for Communications
• Signal processing for Big Data
• Signal processing for the IoTs
• Bio-imaging and biomedical signal processing
• Telemedicine and E-hospital
• Biomechanics

Integrated Circuits and Electronics track

• Emerging IC technologies
• VLSI Design Automation
• Digital, Analog and Mixed-Signal ICs and Systems
• RF IC Front-end and Transceivers
• Low power design
• Electronic Circuits and Systems
• Embedded Systems
• Automation, Robotics and Control
• Consumer and Automotive Electronics
• Sensor Systems

Networking track

• Ad hoc & Sensor Networks
• Computer Communications
• Optical Networking
• Satellite Communications
• High-Speed Networking
• Network Operations & Management

Microwave Engineering track

• Microwave Theory & Techniques
• RF, Microwave Circuits, Systems & Applications
• Millimeter Wave, THz Technologies and Systems
• Power Amplifier Devices and Circuits

Antennas and Propagation track

• Antenna Systems
• Integrated Antennas, Smart Antennas, Digital Beamforming, Related Circuits and Components
• Electromagnetic Scattering, Channel Measurement and Propagation
• Computational Methods for Wave Propagation

***Submission & Policies***                
Submitted papers (for both regular and special sessions) are subject to a blind reviewed process handled by an international technical program committee. An author of an accepted paper must register at full rate (member or non-member of the IEEE or REV) prior to uploading the camera-ready version. The maximum length of the camera-ready version is 6 pages. Conference content will be submitted for inclusion into IEEE Xplore as well as other Abstracting and Indexing (A&I) databases. The IEEE reserves the right to exclude a paper from distribution after the conference (e.g., removal from IEEE Xplore) if the paper is not presented at the conference.

Paper submission on EDAS:

***Organization Committee***
Honorary Co-chairs

• Nguyen Van Ngo, REV, VN
• Phan Anh, REV, VN
• Nguyen Ngoc Binh, REV, VN

Steering Co-chairs

• Vu Van San, PTIT, Vietnam
• Nguyen Hong Vu, REV, VN

General Chairs

• Hikmet Sari, NUPT, China
• Tan Hanh, PTIT, Vietnam
• Truong Vu Bang Giang, REV, VN

Technical Program Chairs

• Vo Nguyen Quoc Bao, PTIT, VN
• Ha Hoang Kha, HCMUT, VN

Financial Co-Chairs

• Pham Minh Quang, PTIT, Vietnam

Local Arrangement Co-Chairs

• Tran Trung Duy, PTIT, Vietnam
• Pham Thi Yen Linh, PTIT, Vietnam
• Tran Cong Hung, PTIT, Vietnam

Publication Co-Chairs

• Huynh Van Hoa, PTIT, Vietnam

Publicity Co-Chairs

• Hoang Hong Duc, REV, VN
• Le Quang Phu, PTIT, Vietnam

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[CFP]: The 7th International Conference on Integrated Circuits, Design, and Verification (ICDV 2017)

The 7th International Conference on Integrated Circuits, Design, and Verification (ICDV 2017)

October 5-6, 2017 – Hanoi, Vietnam

Hosted by

VNU University of Engineering and Technology
Sponsored by

IEEE SSCS Vietnam Chapter and IEICE Vietnam Section
Participating-Sponsored by

IEEE SSCS Japan Chapter, IEEE SSCS Kansai Chapter, and the Radio-Electronics Association of Vietnam

Accepted and presented papers will be included in the conference proceedings with ISBN and will be submitted to the IEEE.

The International Conference on Integrated Circuits, Design, and Verification (ICDV) provides an annual forum for exchanging ideas, discussing research results, and presenting chips, circuit designs and applications in solid-state and semiconductor fields. Continuous scaling of the CMOS devices increases the number of transistors on a VLSI chip. It will soon reach the level of 10 giga transistors on a single chip, which is equivalent to the total neuron numbers in the human brain. This would certainly provide us a great opportunity for new applications and information processing. On the other hands, the small feature size causes new problems such as leakage current and process variation. To discuss utilizing the scaling advantages and coping with the new problems, we call for contributions about new proposal of application systems, VLSI architectures, and design methodologies as well as the technologies in the integrated circuits and devices field. We expect to this conference explores and stimulates the contributed researches to those subjects. The papers are solicited from prospective authors interested in the related fields.

The ICDV 2017 conference is sponsored by the IEEE SSCS Vietnam and the IEICE Vietnam Section, hosted by VNU University of Engineering and Technology (VNU-UET), and will be held in Hanoi, Vietnam. Further details on the conference, paper submission guidelines, and templates will be updated on the website.
***Important Dates*

Title & abstract submission: July 1, 2017
Full manuscript submission: July 10, 2017
Notification of acceptance: August 30, 2017
Camera-ready submission: September 15, 2017

*** Paper Submission ***

Submission link:

Prospective authors are invited to submit full-length, maximum six-page manuscripts, including figures, tables and references, to
the official ICDV 2017 website. All papers will be handled electronically. Accepted and presented papers will be included in the conference proceedings with ISBN and will be submitted to the IEEE (the copyright shall be assigned to the IEEE) and will be invited to re-submit an extension to REV Journal on Electronics and Communications (JEC) and VNU Journal of Computer Science and Communication Engineering (JCSCE). Papers are solicited in the following categories, but are not limited to:
1. Digital integrated circuits and signal processing
2. Processors/ multiprocessors
3. Memory design
4. Analog and mixed-signal circuits
5. RF integrated circuits and microwave engineering
6. Circuit technologies
7. Design experience with advanced design technologies
8. Circuits/devices modeling, verification and testing
9. Reconfigurable architectures & FPGA-based designs
10. Embedded systems design
11. IoT related circuits, devices and applications
12. Rebooting computing


General Co-chairs
Xuan-Tu Tran, VNU-UET
Kunio Uchiyama, Hitachi
Ngoc-Binh Nguyen, REV
Ngoc-Nam Pham, HUST

Technical program co-Chairs
Toshimasa Matsuoka, Osaka Uni.
Cong-Kha Pham, Elec.-Comm. Uni.
Van-Phuc Hoang, LQD TU
Loan Pham, HUST

Local Arrangement Chair
Tran Duc Tan, VNU-UET
Kiem-Hung Nguyen, VNU-UET
Duy-Hieu Bui, VNU-UET

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[EDAS-CFP] SigTelCom 2018 – Special issue on IET Communications “Recent Advances on 5G”

Call for Papers 

The International Conference on Recent Advances on Signal Processing, Telecommunications & Computing (SigTelCom 2018)

January 29-31st, 2018

Post & Telecommunications Institute of Technology, Ho Chi Minh City, Vietnam

SigTelCom 2017 is technically co-sponsored by IEEE and IEEE Vietnam Section.

Accepted and presented papers will be published in the conference proceedings and IEEE Xplore® (IEEE Digital Library).

High quality papers will be invited to be submitted to Special Issues “Recent Advances on 5G” of IET Communications (SCI journal and Q2 SCImago)


**Important Dates**

Submission of full papers: June 30th, 2017 

Notification of acceptance:  September 30th, 2017

Camera ready papers and registration: November 1st, 2017

Main Conference: January 29-31st, 2018


**Topics of Interest**

The SigTelCom 2018 seeks original contributions in, but not limited to, the following tracks topical areas:

* Signal Processing

– Decoding and encoding techniques

– Modulation, coding, and diversity techniques

– Signal detection and parameter estimation

– Signal, image and video processing

– Image Processing and Visualization

– Audio, acoustic signal, speech and language processing

– Sensor array, multichannel and communications signal processing

– Radar and sonar array signal processing

– Estimation theory and applications

– Signal processing for education

– Bio-inspired modelling and signal processing

– Signal processing applications

* Telecommunications Systems and Networks

– Cooperative communications

– Cognitive radio and dynamic spectrum access

– Multi-carrier systems, including OFDM

– Multiple-input multiple-output techniques

– Ultra-wideband and spread spectrum communications

– Cellular systems, 2G/2.5G/3G/4G and beyond

– WiMAX, LTE, WMAN, and other emerging broadband wireless networks

– Wireless networks for underwater and UAVs communications

– Delay tolerant wireless networks

– Routing and multicasting protocols

– Wireless ad hoc, mesh networks

– Sensor networks and mobile sensing

– Peer-to-peer wireless networks

– Wireless multimedia networks

– Optical Networks

– Software defined networks

– Software defined datacenters

– Wireless body area network and wireless health

– Overlay and programmable networks

– Internet of Things and smart cities

– Services and support for smart cities

– Software defined smart objects

– Connected vehicles

– Green communications and energy efficiency

– Next generation networks infrastructures and management

– Distributed systems architecture and Management

– Network reliability, quality of service and quality of experience

– Standardization activities of emerging technologies

– Medium access techniques and protocols for telecommunication networks

– Security, cryptography and privacy

– Network design, optimisation and management

– Network planning, capacity analysis, and topology control

– Network measurement, validation and verification schemes

– Testbeds and deployment

* Computing Technologies

– Parallel and distributing computing

– High-performance computing

– Grid computing

– Cloud computing

– Green computing

– Ubiquitous computing

– Peer-to-peer and cluster computing

– Software engineering artificial intelligent systems applications

– Human language technologies

– Knowledge discovery and data mining

– Mobile learning applications

– Mobile development applications

– Pervasive and wearable computing

– Web-based computing and services

– Wireless and mobile computing

– Multimedia computing applications and architectures

– Security and trust computing

– Computing operating systems

– Social networks, crowd sourcing, and crowd sensing

* Electronics and Control Systems

– Devices, circuits and systems

– Power electronics and systems

– Energy systems

– Air and water pollution management and control

– Embedded systems

– Emerging IC technologies

– Monitoring and control of structures

– Consumer and automotive electronics

– Networked control systems

– Automation, robotics and control

– Dynamics, vibration and control

– Intelligent transportation systems


**Submission Guidelines**

Submitted papers must represent original material that is not currently under review in any other conference or journal, and has not been previously published. Authors must submit their work electronically through EDAS system at :

The paper should have a maximum of 6 pages in the IEEE format (available at Papers must be submitted in PDF format only.

Accepted and presented papers will be published in the conference proceedings and IEEE Xplore® (IEEE Digital Library).


**Orgnization Committee**

General Chairs:

– Trung Q. Duong, Queen’s University Belfast, UK Le Cong Co, Duy Tan University, Vietnam

 Technical Program Chairs:

– Vo Nguyen Quoc Bao, PTIT, Vietnam

– Hien Q. Ngo, Linköping University, Sweden

Publication Chair:

– Nguyen-Son Vo, Duy Tan University, Vietnam

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